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PAI SOLDERING CONSUMBLES
PAI Solder Paste
Product Brochure
Material Type | Paste |
Brand | PAI |
Material Composition | SN63/PB37 |
Melting Point | 217 DegreeC~219 DegreeC |
Viscosity | 200 +- 30 Pa.s (25 +/-1 DegreeC, 10 rpm, Malcom) |
Weight | 11 g |
- The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others.
- Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow.
- This paste is lead-free and ideal for gap filling and on vertical surfaces application.
Specifications:
Shenmao / PAI Lead Free Solder Paste Sn-Ag-Cu (SAC) Series | ||||||
Item/Product | SP606-P | SP607-P | SP608-P | SP609-P | SP610-P | SP614-P |
Alloy | Sn/Ag3.0Cu0.5 | Sn/Ag3.5/Cu0.7 | Sn/Ag3.9/Cu0.6 | Sn/Ag3.8/Cu0.7 | Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01 | Sn/Ag4.0/Cu0.5 |
Melting Point (°C) | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 |
Particle Sixe (um) | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45 , 20-38 |
Flux Content (%) | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 |
Flux Type | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 |
Halide content(%) | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
Fluoride | None | None | None | None | None | None |
Viscosity (Pa.s) | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 |
Spread(%) | 80 | 80 | 80 | 80 | 80 | 80 |
Tackiness (gf) | 140 | 140 | 140 | 140 | 140 | 140 |
Corrosion | PASS | PASS | PASS | PASS | PASS | PASS |
S.I.R | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 |
Electro Migration | PASS | PASS | PASS | PASS | PASS | PASS |
Note: We also provide lead-free micro solder paste for flip chip process.
Tin Lead Solder Wires
Product Brochure
Packaging Size | 500 Grams/Reel |
Wire Gauge | 22 SWG |
Usage/Application | For Industrial Use |
Flux | 2% |
Country of Origin | Made in India |
High purity alloy that is composed of 60% Tin and 40% Lead from virgin metals.
Applies at hand or feed soldering processes in Electronics & Electrical assemblies.
Non-corrosive and no impact of flux residues forming at post soldering which means of passing in pin probe & flying probe tests for No Clean solder wires.
If required, flux residues shall be cleaned with appropriate liquid application.
Précised amount of flux cored from state-of the-art-technology manufacturing process.
Lead Free Solder Wire
Product Brochure
Wire Gauge | 22 SWG |
Composition | Lead Free |
Brand | PAI |
Packaging Size | 500 Grams/Reel |
Diameter | 0.8 mm |
Material | Sn99.3Cu0.7 |
Flux | 2% |
Country of Origin | Made in India |
Sharang Solder Wires
Product Brochure
Wire Gauge | 16 SWG |
Brand | sharang |
Warranty | 1 year |
Minimum Order Quantity | 1 kg |
Country of Origin | Made in India |
We are engaged in offering Solder Wires to our valuable clients.And offers at best prices.
Sn Cu Solder Stick
Product Brochure
Composition | Lead Free |
Brand | PAI |
Usage/Application | Soldering |
Sn | 99.3% |
Cu | 0.3% |
Country of Origin | Made in India |
PAI Sn99.3Cu0.7 RoHS Compliance Solder Sticks are being formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. PAI Sn99.3Cu0.7 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.
Sn Pb Solder Stick
Product Brochure
Brand | PAI |
Composition | 63/37 Tin/Lead |
Packaging Size | 1 Kg/Reel |
Usage/Application | Soldering |
Shape | Rectangular |
Length | 3 m |