Sharang Corporation

The EMST 100 kg Automatic Wave Soldering Machine is a precision-engineered soldering solution designed for semi-automatic PCB assembly lines. Featuring 7 independent preheat zones and a specialized dual wave system, this machine is optimized for high-quality through-hole soldering in the medical device, automotive, and industrial electronics sectors.

Key Specifications:

•Solder Pot Capacity: 100 kg

•Conveyor Width: 250 mm

•Wave Width: 300 mm

•Wave Type: Dual wave

•Preheat Zones: 7 Zone (Enhanced thermal control)

•Automation Grade: Semi Automatic

•Fluxing System: Spray fluxer

•Input Voltage: 440V

•Power Consumption: 7 KW

•Output Current: 50A

•Solder Temp Range: 200-350 °C

Key Features:

•Advanced 7-Zone Preheating: Equipped with 7 independent preheat zones, allowing for an extremely gradual and precise thermal ramp-up to ensure optimal flux activation and minimize thermal shock to the PCB.

•Precision Dual Wave Technology: Features a dual wave soldering mechanism designed to provide superior wetting and eliminate solder skips, even on dense or complex board layouts.

•Efficient Spray Fluxer: Includes an integrated spray fluxer system that provides consistent and uniform coverage across the bottom of the PCB while reducing flux waste.

•Optimized for Smaller Footprints: With a 250 mm conveyor width and a 100 kg pot, this machine offers a compact industrial solution without sacrificing professional-grade soldering capabilities.

•High Thermal Stability: Maintains a stable solder temperature between 200-350 °C, ensuring compatibility with standard leaded and lead-free soldering requirements.

•Industrial Power Efficiency: Operates at a moderate 7 KW power consumption on a standard 440V three-phase supply, balancing high-performance output with operational cost-effectiveness.

•Reliable Local Manufacturing: Proudly Made in India by EMST, ensuring robust build quality and accessible technical support for regional manufacturing facilities.

The EMST 200 kg Wave Soldering Machine is a robust industrial solution designed for precision PCB assembly in semi-automated production lines. Engineered with a high-capacity 200 kg solder pot and advanced dual wave technology, this system provides the thermal stability and reliability required for high-quality through-hole soldering in the automotive, industrial, and consumer electronics sectors.

Key Specifications:

•Solder Pot Capacity: 200 kg

•Conveyor Width: 500 mm

•Conveyor Speed: 1000 mm/min

•Wave Type: Dual wave

•Preheat Zones: 4 Zone

•Automation Grade: Semi Automatic

•Fluxing System: Spray fluxer

•Power Rating: 25 kW

•Input Voltage: 440V

•Output Current: 50A

•Solder Temp Range: 200-400 °C

•Control Type: PLC control

Key Features:

•High-Volume Solder Pot: The 200 kg capacity ensures high thermal inertia, maintaining a consistent solder temperature even during continuous, high-load production runs.

•Wide Conveyor Processing: Features a generous 500 mm conveyor width, allowing for the processing of large-format PCBs or multiple smaller boards simultaneously.

•Advanced Dual Wave System: Utilizes dual wave technology to ensure optimal solder wetting and eliminate common defects like bridging or skipping on complex board layouts.

•Precision 4-Zone Preheating: Equipped with 4 independent preheat zones to ensure the PCB reaches the ideal temperature for flux activation, preventing thermal shock upon entering the solder wave.

•Efficient Spray Fluxing: Includes an integrated spray fluxer that provides uniform coverage on the bottom of the PCB while minimizing chemical consumption.

•Industrial PLC Control: Driven by a reliable PLC control system, enabling operators to manage and store precise process parameters for repeatable soldering results.

•Extended Temperature Range: Supports a wide temperature range of up to 400 °C, ensuring full compatibility with both traditional leaded and modern lead-free solder alloys.

•Robust Power Delivery: Operates on a 440V industrial supply with a 25 kW power rating, providing the necessary energy for rapid heating and stable long-term operation.

The Wave Soldering Machine FC400 is a high-performance, fully automated industrial soldering system designed for large-scale PCB assembly. Featuring a massive 250 kg solder pot capacity and advanced dual wave technology, this machine is engineered to deliver high-quality, reliable solder joints for through-hole components in the automotive, telecom, and industrial electronics sectors.

Key Specifications:

•Solder Pot Capacity: 250 kg (High-capacity for continuous production)

•Conveyor Width: 350 mm

•Conveyor Speed: 1500 mm/min (High-speed throughput)

•Wave Type: Dual Wave (Optimized for complex board geometries)

•Preheat Zones: 4 Zone (Precision thermal management)

•Automation Grade: Automatic

•Control Type: PLC Control

•Input Voltage: 440V

•Power Consumption: 8 kW

•Output Current: 70A

•Solder Temp Range: 200-350 °C

Key Features:

•High-Efficiency Dual Wave System: Utilizes a Dual Wave mechanism—a turbulent "chip wave" followed by a smooth "lambda wave"—to ensure complete solder penetration and eliminate bridging or shadowing on high-density boards.

•Rapid Production Throughput: Features an impressive conveyor speed of 1500 mm/min, making it one of the fastest in its class for high-volume manufacturing environments.

•Advanced Spray Fluxer: Equipped with a precision Spray Fluxer system that ensures uniform flux application while minimizing waste and maintaining a clean internal environment.

•Precise 4-Zone Preheating: Includes 4 independent preheat zones to gradually raise the PCB temperature, activating the flux and preventing thermal shock before the board hits the solder wave.

•Intelligent PLC Management: Driven by a robust PLC control system, allowing operators to store and recall specific profiles for different PCB designs, ensuring consistent results.

•Large Capacity Pot: The heavy-duty 250 kg solder pot provides high thermal stability and reduces the frequency of solder replenishment, maximizing uptime.

•Industrial Durability: Built to handle the rigors of 24/7 industrial use with a 440V three-phase power requirement and a high 70A output current for rapid heating.

•Wide Temperature Versatility: With a solder temperature range of up to 350 °C, the machine is fully compatible with both leaded and high-temperature lead-free soldering processes.

The EMST 180 kg Automatic Wave Soldering Machine is a high-precision, industrial-grade solution designed for robust PCB assembly. Engineered for maximum efficiency in high-volume production, this system features a high-capacity 180 kg solder pot and advanced dual wave technology, ensuring reliable and uniform solder joints for complex through-hole components.

Key Specifications:

•Solder Pot Capacity: 180 kg (High thermal mass for consistent temperature)

•Conveyor Width: 350 mm

•Wave Width: 410 mm

•Wave Type: Dual wave (Optimized for high-density board layouts)

•Preheat Zones: 4 Zone (Precision thermal management)

•Automation Grade: Automatic

•Fluxing System: Spray fluxer (Uniform and efficient coverage)

•Power Consumption: 8 kW

•Input Voltage: 440V

•Output Current: 50A

•Solder Temp Range: 200-350 °C

Key Features:

•Optimized Dual Wave System: Features a dual wave mechanism—including a turbulent "chip wave" and a smooth "lambda wave"—to guarantee superior wetting and eliminate solder bridging or shadowing on dense PCB designs.

•High-Capacity Solder Pot: The 180 kg pot provides exceptional thermal stability, preventing temperature fluctuations during continuous production cycles and ensuring high-quality results.

•Precision 4-Zone Preheating: Equipped with 4 independent preheat zones to ensure a controlled thermal ramp-up, activating the flux effectively and preventing thermal shock to the components.

•Efficient Spray Fluxing: Utilizes a precision spray fluxer system that delivers a uniform mist across the PCB underside, significantly reducing flux waste and keeping the process environment clean.

•Fully Automatic Operation: Designed for seamless integration into high-throughput production lines, minimizing manual intervention and maintaining strict adherence to soldering profiles.

•Robust Industrial Build: Operates on a standard 440V industrial supply, built to withstand the rigors of 24/7 manufacturing environments with a peak 50A output.

•Versatile Lead-Free Capability: With a temperature range reaching 350 °C, the machine is fully compatible with modern lead-free alloys and traditional leaded soldering processes.

•Reliable Indian Engineering: Proudly Made in India by EMST, ensuring a balance of advanced industrial technology and localized support for the electronics manufacturing sector.

The 250 kg Pcb Wave Soldering Machine is a robust, semi-automatic solution designed for high-capacity industrial PCB assembly. Featuring a high-thermal-mass 250 kg solder pot and advanced dual wave technology, this machine is engineered to deliver stable and consistent soldering results for complex through-hole components in large-scale manufacturing environments.

Key Specifications:

•Solder Pot Capacity: 250 kg

•Conveyor Width: 350 mm

•Conveyor Speed: 800 mm/min

•Wave Type: Dual wave

•Preheat Zones: 3 zone

•Automation Grade: Semi Automatic

•Fluxing System: Spray fluxer

•Power Rating: 30 kW

•Power Consumption: 7 KW

•Input Voltage: 440V

•Output Current: 50A

•Solder Temp Range: 200-350 °C

•Control Type: PLC control

Key Features:

•Substantial Thermal Stability: The 250 kg solder pot provides a massive thermal reservoir, ensuring the solder temperature remains highly stable during continuous production runs, which is critical for maintaining joint quality.

•Precision Dual Wave System: Utilizes a dual wave mechanism to ensure complete wetting of all solder joints while effectively eliminating bridging and shadowing on high-density boards.

•Intelligent PLC Management: Managed by a reliable PLC control system, allowing operators to precisely set and maintain critical parameters for high repeatability.

•Efficient 3-Zone Preheating: Features 3 independent preheat zones that gradually bring the PCB to the required temperature, ensuring optimal flux activation and reducing the risk of thermal shock.

•Advanced Spray Fluxer: Includes an integrated spray fluxing system that delivers a uniform application across the board surface, enhancing solderability while minimizing chemical waste.

•Industrial Grade Power: Operates on a 440V three-phase supply with a 30 kW power rating, providing the rapid heating capabilities needed for heavy-duty industrial workflows.

•Versatile Temperature Range: Offers a broad operating window of 200-350 °C, making it compatible with a wide variety of leaded and specialized solder alloys.

•Optimized Throughput: Designed for steady production with a conveyor speed of 800 mm/min, balancing speed with the precision required for high-quality electronics assembly.

The Carrier Type Dual Wave Soldering Machine is a high-speed, automated soldering solution optimized for high-volume PCB assembly. Featuring a 250 kg solder pot and integrated Nitrogen support, this machine utilizes a specialized carrier system and drop jet fluxing to deliver superior solder joint quality for both through-hole and SMT components.

Key Specifications:

•Solder Pot Capacity: 250 kg (High thermal stability for heavy-duty use)

•Conveyor Speed: 1500 mm/min (Exceptional throughput for mass production)

•Conveyor Width: 350 mm

•Wave Type: Chip wave (High-energy wave for dense component layouts)

•Fluxing System: Drop jet fluxer (High-precision, targeted flux application)

•Nitrogen Option: With Nitrogen (Prevents oxidation and reduces solder dross)

•Preheat Zones: 2 Zone

•Power Rating: 10 kW

•Automation Grade: Automatic

•Control Type: PLC control

•Solder Temp Range: 200-350 °C

Key Features:

•Precision Drop Jet Fluxing: Equipped with an advanced Drop jet fluxer that applies flux only where needed, significantly reducing chemical waste and maintaining a cleaner PCB surface.

•High-Speed Carrier Conveyor: Features a rapid 1500 mm/min conveyor speed, utilizing a carrier-type system to move boards efficiently through the soldering process while maintaining perfect alignment.

•Nitrogen-Enriched Soldering: The inclusion of a Nitrogen option creates an inert atmosphere, which dramatically improves wetting, reduces solder bridges, and lowers maintenance costs by minimizing dross.

•Powerful Chip Wave Technology: Specifically designed with a chip wave to ensure complete solder coverage on high-density boards, reaching into tight spaces that standard waves might miss.

•Reliable Thermal Mass: The 250 kg pot provides the necessary thermal inertia to handle continuous production without temperature drops, ensuring every board meets the same quality standard.

•Streamlined PLC Control: Managed by a robust PLC control system, providing operators with an intuitive interface to manage speed, wave height, and temperature profiles.

•Compact Efficiency: At a 10 kW power rating, this machine balances high-output performance with optimized energy consumption, making it a cost-effective choice for modern factories.

•Wide Compatibility: Supports a soldering range up to 350 °C, making it suitable for a variety of leaded and lead-free industrial solder alloys.

300 kg Wave Soldering System, EMST (Automatic)

The EMST 300 kg Wave Soldering System is an elite, high-capacity solution engineered for continuous, high-volume PCB manufacturing. With its massive 300 kg solder pot and high-speed 1200 mm/min conveyor, this system provides the heavy-duty thermal stability and automated precision required for modern, demanding production lines.

Key Specifications:

•Solder Pot Capacity: 300 kg (High thermal reservoir for process consistency)

•Conveyor Speed: 1200 mm/min (Optimized for high throughput)

•Conveyor Width: 350 mm

•Wave Type: Dual wave (Ideal for complex SMD/Through-hole mix)

•Automation Grade: Automatic

•Power Rating: 30 kW

•Output Current: 50A

•Preheat Zones: 4 zone

•Fluxing System: Spray fluxer

•Solder Temp Range: 200-400 °C

•Input Voltage: 230V

•Control Type: PLC control

Key Features:

•Superior Thermal Stability: The 300 kg capacity pot acts as a powerful thermal buffer, ensuring that even under heavy production loads, the solder temperature remains steady for high-reliability joints.

•Rapid Industrial Throughput: Features an impressive 1200 mm/min conveyor speed, making it one of the most efficient systems for mass-market electronic assembly.

•Versatile Dual Wave Action: Utilizes a dual wave system to prevent "shadowing" on high-density boards, ensuring complete solder coverage for both large through-hole components and small SMDs.

•Intelligent PLC Interface: Managed by a robust PLC control system, allowing for the precise storage and execution of complex soldering profiles for consistent repeatability.

•Precision 4-Zone Preheating: Equipped with 4 independent preheat zones to ensure a perfect thermal transition, properly activating flux while protecting sensitive board substrates.

•Lead-Free Compatible: Capable of reaching temperatures up to 400 °C, this system is fully prepared to handle the higher melting points required by modern ROHS-compliant lead-free alloys.

•Efficient Flux Application: Includes an integrated spray fluxer that ensures highly uniform coverage on the bottom of the PCB, reducing waste and improving soldering performance.

•Industrial Reliability: Proudly Made in India, combining a high 30 kW power rating with localized engineering support for long-term production uptime.

The EMST Stallion PLC TT-JW is a high-performance, compact Table Top wave soldering machine designed for precision PCB assembly. Despite its table-top classification, it boasts a massive 250 kg solder pot and advanced Nitrogen capabilities, making it an elite choice for high-reliability electronics manufacturing where space is at a premium but industrial power is required.

Key Specifications:

•Solder Pot Capacity: 250 kg (Exceptional thermal mass in a table-top format)

•Power Rating: 30 kW

•Nitrogen Option: With Nitrogen (Enables high-quality soldering with reduced dross)

•Conveyor Width: 250 mm

•Wave Width: 350 mm

•Wave Type: Dual wave (Chip wave + Lambda wave)

•Preheat Zones: 4 Zone

•Automation Grade: Automatic

•Control Type: PC control

•Input Voltage: 440V

•Solder Temp Range: 200-400 °C

Key Features:

•Advanced Nitrogen Environment: Includes a Nitrogen option to minimize solder oxidation, significantly reducing dross formation and ensuring shiny, high-integrity solder joints.

•Massive Table-Top Capacity: Unique in its class, it features a 250 kg pot, providing the thermal stability of a full-sized machine within a Table Top (TT) footprint.

•Precision Dual Wave System: Utilizes Dual wave technology to eliminate "shadowing" and bridging, ensuring total solder penetration for high-density SMD and through-hole boards.

•High-Power Industrial Capability: Features a 30 kW power rating and 70A output, allowing the machine to reach and maintain stable temperatures up to 400 °C for lead-free processes.

•Sophisticated PC Control: Managed via a PC control system for advanced data logging, complex thermal profiling, and seamless automated operation.

•Efficient Thermal Management: Equipped with 4 independent preheat zones to ensure the PCB is perfectly conditioned before hitting the wave, reducing thermal stress on sensitive components.

Integrated Spray Fluxing: Features a built-in spray fluxer that ensures highly uniform and consistent flux application across the board surface.

Professional Grade Build: Designed for serious manufacturing, operating on a 440V supply to deliver consistent performance for mission-critical electronic assembly.

The EMST 80 kg Lead-free Wave Soldering Machine is a precision-engineered, fully automated system designed for high-quality electronics assembly. Optimized for lead-free processes, this machine features an advanced 6-zone preheat system and a specialized single wave design, making it an ideal choice for manufacturers requiring consistent results in a compact industrial format.

Key Specifications:

•Solder Pot Capacity: 80 kg (Specifically designed for lead-free alloys)

•Preheat Zones: 6 Zone (Superior thermal profiling)

•Wave Width: 410 mm

•Conveyor Width: 250 mm

•Wave Type: Single wave

•Automation Grade: Automatic

•Output Current: 70A

•Power Consumption: 8 KW

•Solder Temp Range: 180-300 °C

•Input Voltage: 230V

•Fluxing System: Spray fluxer

Key Features:

•Lead-Free Optimized Pot: The 80 kg capacity pot is constructed with materials specifically treated to resist the corrosive nature of lead-free solder, ensuring a long operational lifespan and high thermal stability.

•Precision 6-Zone Preheating: Features 6 independent preheat zones, providing a highly controlled thermal ramp to ensure proper flux activation and minimize thermal shock to sensitive components.

•Efficient Single Wave Technology: Equipped with a 410 mm wide single wave, designed to provide optimal wetting and a smooth finish for a wide variety of through-hole PCB assemblies.

•Integrated Spray Fluxing: Features a precision spray fluxer that ensures uniform and consistent application of flux across the PCB, reducing waste and improving overall solder joint integrity.

•Full Automation: As an Automatic grade machine, it streamlines the production process, reducing the need for manual intervention and ensuring high repeatability across large batches.

•High-Current Stability: With an output current of 70A and an 8 KW power consumption, the machine offers the necessary power to maintain precise temperature control even during continuous use.

•Reliable Indian Engineering: Proudly Made in India, this machine combines industrial-grade performance with the advantage of localized support and easy availability of spare parts.

•User-Friendly Operation: Designed for integration into modern manufacturing lines with a standard 230V input, making it versatile for various factory power configurations.

The EMST 300 kg Automatic Wave Soldering Machine is a heavy-duty industrial powerhouse designed for high-volume, lead-free PCB assembly. Featuring an expansive 10-zone preheat system and a massive 300 kg solder pot, this machine is engineered for maximum thermal stability and precision in demanding 24/7 manufacturing environments.

Key Specifications:

•Solder Pot Capacity: 300 kg (Massive thermal reservoir for stable lead-free processing)

•Preheat Zones: 10 Zone (Precision thermal profiling)

•Power Rating: 30 kW

•Conveyor Speed: 1000 mm/min

•Wave Type: Dual wave (Ideal for high-density SMD and through-hole)

•Wave Width: 410 mm

•Conveyor Width: 300 mm

•Solder Temp Range: 200-400 °C

•Automation Grade: Automatic

•Control Type: PC control

•Input Voltage: 230V

Key Features:

•Elite 10-Zone Preheating: Equipped with 10 independent preheat zones, providing the most granular control available to ensure PCBs reach the perfect temperature before soldering, preventing thermal shock.

•Superior Thermal Mass: The 300 kg solder pot provides incredible temperature consistency, which is vital for lead-free soldering where the process window is significantly narrower.

•High-Power Performance: With a 30 kW power rating and a 70A output current, this machine offers rapid recovery times and the strength to handle continuous, high-volume production runs.

•Dual Wave Precision: Features a dual wave system that ensures deep solder penetration and eliminates common defects like bridging, even on boards with complex geometries.

•Advanced PC Control: Driven by a PC-based control system, allowing for sophisticated data logging, complex recipe management, and high levels of process repeatability.

•Lead-Free Optimized: Specifically designed and treated to withstand the corrosive nature of lead-free alloys, with a temperature capability reaching up to 400 °C.

•Wide Application Wave: A 410 mm wave width allows for the processing of large boards, supported by a precision spray fluxing system for uniform chemical application.

•Reliable Indian Engineering: Proudly Made in India, combining high-end industrial specifications with local support and availability.