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Pioneers in the industry, we offer solder wire and solder paste from India.

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Solder Wire

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Product Details:

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The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others.
Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow.
This paste is lead-free and ideal for gap filling and on vertical surfaces application.

Specifications:

Shenmao / pai lead free solder paste Sn-Ag-Cu (SAC) Series
Item/Product	SP606-P	SP607-P	SP608-P	SP609-P	SP610-P	SP614-P
Alloy	Sn/Ag3.0Cu0.5	Sn/Ag3.5/Cu0.7	Sn/Ag3.9/Cu0.6	Sn/Ag3.8/Cu0.7	Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01	Sn/Ag4.0/Cu0.5
Melting Point (°C)	217-219	217-219	217-219	217-219	217-219	217-219
Particle Sixe (um)	20-45 ,20-38	20-45,20-38	20-45 ,20-38	20-45,20-38	20-45 ,20-38	20-45 , 20-38
Flux Content (%)	11+/-0.5	11+/-0.5	11+/-0.5	11+/-0.5	11+/-0.5	11+/-0.5
Flux Type	R0L1	R0L1	R0L1	R0L1	R0L1	R0L1
Halide content(%)	0.05	0.05	0.05	0.05	0.05	0.05
Fluoride	None	None	None	None	None	None
Viscosity (Pa.s)	200+30	200+30	200+30	200+30	200+30	200+30
Spread(%)	80	80	80	80	80	80
Tackiness (gf)	140	140	140	140	140	140
Corrosion	PASS	PASS	PASS	PASS	PASS	PASS
S.I.R	> 1 x 109	> 1 x 109	> 1 x 109	> 1 x 109	> 1 x 109	> 1 x 109
Electro Migration	PASS	PASS	PASS	PASS	PASS	PASS

Note: We also provide lead-free micro solder paste for flip chip process.

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