Sharang Corporation
Sharang Corporation
Dapodi, Pune, Maharashtra
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Industrial Solders

Pioneers in the industry, we offer solder paste and solder wire from India.
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Solder Paste
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Solder Paste

Approx. Price: Rs 3,307 / kgGet Latest Price
Product Details:
Material TypePaste
BrandPAI
Material CompositionSN63/PB37
Melting Point217 DegreeC~219 DegreeC
Viscosity200 +- 30 PA.s (25+-1 DegreeC, 10rpm, Malcom )
Weight11 g
  • The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others.
  • Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow.
  • This paste is lead-free and ideal for gap filling and on vertical surfaces application.

Specifications:
Shenmao / pai lead free solder paste Sn-Ag-Cu (SAC) Series
Item/Product SP606-P SP607-P SP608-P SP609-P SP610-P SP614-P
Alloy Sn/Ag3.0Cu0.5 Sn/Ag3.5/Cu0.7 Sn/Ag3.9/Cu0.6 Sn/Ag3.8/Cu0.7 Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01 Sn/Ag4.0/Cu0.5
Melting Point (°C) 217-219 217-219 217-219 217-219 217-219 217-219
Particle Sixe (um) 20-45 ,20-38 20-45,20-38 20-45 ,20-38 20-45,20-38 20-45 ,20-38 20-45 , 20-38
Flux Content (%) 11+/-0.5 11+/-0.5 11+/-0.5 11+/-0.5 11+/-0.5 11+/-0.5
Flux Type R0L1 R0L1 R0L1 R0L1 R0L1 R0L1
Halide content(%) 0.05 0.05 0.05 0.05 0.05 0.05
Fluoride None None None None None None
Viscosity (Pa.s) 200+30 200+30 200+30 200+30 200+30 200+30
Spread(%) 80 80 80 80 80 80
Tackiness (gf) 140 140 140 140 140 140
Corrosion PASS PASS PASS PASS PASS PASS
S.I.R > 1 x 109 > 1 x 109 > 1 x 109 > 1 x 109 > 1 x 109 > 1 x 109
Electro Migration PASS PASS PASS PASS PASS PASS

Note: We also provide lead-free micro solder paste for flip chip process.

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Solder Wire
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Solder Wire

Approx. Price: Rs 1,509 / KgGet Latest Price
Product Details:
MaterialAluminum
Composition60/40 Tin/Lead
Wire Gauge18 SWG and 22 SWG
Packaging Size500 grams/reel
Diameter0.5-1 mm
Wire TypeWith Lead, Without Lead
High purity alloy that is composed of 60% Tin and 40% Lead from virgin metals.
1.  Applies at hand or feed soldering processes in Electronics & Electrical assemblies.
2.  Non-corrosive and no impact of flux residues forming at post soldering which means of passing in pin probe & flying probe tests for No Clean solder wires.
3.  If required, flux residues shall be cleaned with appropriate liquid application.
4. Précised amount of flux cored from state-of the-art-technology manufacturing process.

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