Sharang Corporation
Sharang Corporation
Dapodi, Pune, Maharashtra
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Industrial Solders

Pioneers in the industry, we offer solder paste and solder wire from India.
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Solder Paste
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Solder Paste

Approx. Price: Rs 3,307 / kgGet Latest Price
Product Details:
Material CompositionSn63/Pb 37
Material TypePaste
BrandPAI
Melting Point217 DegreeC~219 DegreeC
Viscosity200 +- 30 PA.s (25+-1 DegreeC, 10rpm, Malcom )
Weight11 g
  • The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others.
  • Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow.
  • This paste is lead-free and ideal for gap filling and on vertical surfaces application.

Specifications:
Shenmao / pai lead free solder paste Sn-Ag-Cu (SAC) Series
Item/ProductSP606-PSP607-PSP608-PSP609-PSP610-PSP614-P
AlloySn/Ag3.0Cu0.5Sn/Ag3.5/Cu0.7Sn/Ag3.9/Cu0.6Sn/Ag3.8/Cu0.7Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01Sn/Ag4.0/Cu0.5
Melting Point (°C)217-219217-219217-219217-219217-219217-219
Particle Sixe (um)20-45 ,20-3820-45,20-3820-45 ,20-3820-45,20-3820-45 ,20-3820-45 , 20-38
Flux Content (%)11+/-0.511+/-0.511+/-0.511+/-0.511+/-0.511+/-0.5
Flux TypeR0L1R0L1R0L1R0L1R0L1R0L1
Halide content(%)0.050.050.050.050.050.05
FluorideNoneNoneNoneNoneNoneNone
Viscosity (Pa.s)200+30200+30200+30200+30200+30200+30
Spread(%)808080808080
Tackiness (gf)140140140140140140
CorrosionPASSPASSPASSPASSPASSPASS
S.I.R> 1 x 109> 1 x 109> 1 x 109> 1 x 109> 1 x 109> 1 x 109
Electro MigrationPASSPASSPASSPASSPASSPASS

Note: We also provide lead-free micro solder paste for flip chip process.

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Solder Wire
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Solder Wire

Approx. Price: Rs 1,509 / KgGet Latest Price
Product Details:
MaterialAluminum
Packaging Size500 grams/reel
Weight60/40 Tin/Lead
Gauge22 SWG, 18 SWG
Diameter0.5-1 mm
Wire TypeWith Lead, Without Lead
High purity alloy that is composed of 60% Tin and 40% Lead from virgin metals.
1.  Applies at hand or feed soldering processes in Electronics & Electrical assemblies.
2.  Non-corrosive and no impact of flux residues forming at post soldering which means of passing in pin probe & flying probe tests for No Clean solder wires.
3.  If required, flux residues shall be cleaned with appropriate liquid application.
4. Précised amount of flux cored from state-of the-art-technology manufacturing process.

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