Soldering Accessories
Offering you a complete choice of products which include pai solder paste, lead free solder wire, pai aims lead free solder paste and lead free solder paste.
PAI Solder Paste
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₹ 3860 / Kg Get Latest Price
Product Brochure
| Packaging Size | 11 g |
| Brand | PAI |
| Material Type | Paste |
| Material Composition | SN63/PB37 |
| Melting Point | 217 DegreeC~219 DegreeC |
| Viscosity | 200 +- 30 Pa.s (25 +/-1 DegreeC, 10 rpm, Malcom) |
| Weight | 11 g |
Other Details:
Specifications:
Note: We also provide lead-free micro solder paste for flip chip process.
- The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others.
- Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow.
- This paste is lead-free and ideal for gap filling and on vertical surfaces application.
Specifications:
| Shenmao / PAI Lead Free Solder Paste Sn-Ag-Cu (SAC) Series | ||||||
| Item/Product | SP606-P | SP607-P | SP608-P | SP609-P | SP610-P | SP614-P |
| Alloy | Sn/Ag3.0Cu0.5 | Sn/Ag3.5/Cu0.7 | Sn/Ag3.9/Cu0.6 | Sn/Ag3.8/Cu0.7 | Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01 | Sn/Ag4.0/Cu0.5 |
| Melting Point (°C) | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 |
| Particle Sixe (um) | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45 , 20-38 |
| Flux Content (%) | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 |
| Flux Type | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 |
| Halide content(%) | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
| Fluoride | None | None | None | None | None | None |
| Viscosity (Pa.s) | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 |
| Spread(%) | 80 | 80 | 80 | 80 | 80 | 80 |
| Tackiness (gf) | 140 | 140 | 140 | 140 | 140 | 140 |
| Corrosion | PASS | PASS | PASS | PASS | PASS | PASS |
| S.I.R | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 |
| Electro Migration | PASS | PASS | PASS | PASS | PASS | PASS |
Note: We also provide lead-free micro solder paste for flip chip process.
Lead Free Solder Wire
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₹ 4165 / Kg Get Latest Price
Product Brochure
| Composition | lead free |
| Wire Gauge | 22 SWG |
| Packaging Size | 500 Grams/Reel |
| Brand | PAI |
| Country of Origin | Made in India |
| Diameter | 0.8 mm |
| Material | Sn99.3Cu0.7 |
| Flux | 2% |
PAI Sn99.3Cu0.7 RoHS compliance solder wires are being formulated with virgin raw metals processed in state-of-the-art Vaccualloy Technology that brings world class quality along. Here, oxygen interaction with alloy is nil and thus, dross formulation is reduced at PCB assembly process. Also an increased flow rate & reduced impurities found. PAI Sn99.3Cu0.7 alloy is compatible for a typical range of flux application formulas used in Electronics Industry today.
Lead Free Solder Wire
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₹ 4165 / Kg Get Latest Price
Product Brochure
| Wire Diameter | 0.7 mm |
| Alloy Type | SAC0307 |
| Spool Weight | 500 g |
| Flux Core Type | Rosin Core |
| Flux Content | 2.0 % |
| Melting Range | 217 °C |
| Compliance | RoHS |
| Application | PCB Soldering |
| Brand | AIM |
Minimum order quantity: 1 Kg
PAI Sn99.3Cu0.7 RoHS compliance solder wires are being formulated with virgin raw metals processed in state-of-the-art Vaccualloy Technology that brings world class quality along. Here, oxygen interaction with alloy is nil and thus, dross formulation is reduced at PCB assembly process. Also an increased flow rate & reduced impurities found. PAI Sn99.3Cu0.7 alloy is compatible for a typical range of flux application formulas used in Electronics Industry today. Solder prices are based on LME. please ask for prices every time.Price changes everymonth.
Pai Aims Lead Free Solder Paste
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₹ 13104 / Kg Get Latest Price
Product Brochure
| Packaging Size | 1 Kg |
| Usage/Application | Electronics |
| Brand | Pai Aims |
| Model Name/Number | Pai Aims Lead Free Solder Paste |
Minimum order quantity: 1 Kg
Other Details:
Specifications:
Note: We also provide lead-free micro solder paste for flip chip process. price validity will 3 days only.
- The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others.
- Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow.
- This paste is lead-free and ideal for gap filling and on vertical surfaces application.
Specifications:
| Shenmao / PAI Lead Free Solder Paste Sn-Ag-Cu (SAC) Series | ||||||
| Item/Product | SP606-P | SP607-P | SP608-P | SP609-P | SP610-P | SP614-P |
| Alloy | Sn/Ag3.0Cu0.5 | Sn/Ag3.5/Cu0.7 | Sn/Ag3.9/Cu0.6 | Sn/Ag3.8/Cu0.7 | Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01 | Sn/Ag4.0/Cu0.5 |
| Melting Point (°C) | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 |
| Particle Sixe (um) | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45 , 20-38 |
| Flux Content (%) | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 |
| Flux Type | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 |
| Halide content(%) | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
| Fluoride | None | None | None | None | None | None |
| Viscosity (Pa.s) | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 |
| Spread(%) | 80 | 80 | 80 | 80 | 80 | 80 |
| Tackiness (gf) | 140 | 140 | 140 | 140 | 140 | 140 |
| Corrosion | PASS | PASS | PASS | PASS | PASS | PASS |
| S.I.R | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 |
| Electro Migration | PASS | PASS | PASS | PASS | PASS | PASS |
Note: We also provide lead-free micro solder paste for flip chip process. price validity will 3 days only.
Lead Free Solder Paste
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₹ 6800 / Kg Get Latest Price
Product Brochure
| Alloy Composition | Sn96Ag4 |
| Flux Type | Rosin |
| Powder Type | Type 3 |
| Melting Point | 138 C |
| Physical State | Paste |
| Packaging Type | Jar |
| Pack Size | 500 g |
| Usage/Application | For Industrial Use |
| Application | SMT Reflow |
| Brand | Sharang |
| Shelf Life | 12 Months |
| Country of Origin | Made in India |
Other Details:
Specifications:
Note: We also provide lead-free micro solder paste for flip chip process.
- The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others.
- Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow.
- This paste is lead-free and ideal for gap filling and on vertical surfaces application.
Specifications:
| Shenmao / PAI Lead Free Solder Paste Sn-Ag-Cu (SAC) Series | ||||||
| Item/Product | SP606-P | SP607-P | SP608-P | SP609-P | SP610-P | SP614-P |
| Alloy | Sn/Ag3.0Cu0.5 | Sn/Ag3.5/Cu0.7 | Sn/Ag3.9/Cu0.6 | Sn/Ag3.8/Cu0.7 | Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01 | Sn/Ag4.0/Cu0.5 |
| Melting Point (°C) | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 |
| Particle Sixe (um) | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45 , 20-38 |
| Flux Content (%) | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 |
| Flux Type | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 |
| Halide content(%) | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
| Fluoride | None | None | None | None | None | None |
| Viscosity (Pa.s) | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 |
| Spread(%) | 80 | 80 | 80 | 80 | 80 | 80 |
| Tackiness (gf) | 140 | 140 | 140 | 140 | 140 | 140 |
| Corrosion | PASS | PASS | PASS | PASS | PASS | PASS |
| S.I.R | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 |
| Electro Migration | PASS | PASS | PASS | PASS | PASS | PASS |
Note: We also provide lead-free micro solder paste for flip chip process.
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Ajeet Bakare (Founder & CEO)
Sharang Corporation
Second Floor, 205 To 213, Laxmi Plaza, Mumbai Pune Road, Kasarwadi, Opposite Alfa Laval, Pimpri, Chinchwad
Pune - 411034, Maharashtra, India
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