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Soldering Accessories
Offering you a complete choice of products which include pai solder paste, pai aims lead free solder paste, solder sticks and lead free solder paste.
PAI Solder Paste
Product Price: Rs 3,860 / KgGet Best Price
Product Brochure
Product Details:
| Packaging Size | 11 g |
| Brand | PAI |
| Material Type | Paste |
| Material Composition | SN63/PB37 |
| Melting Point | 217 DegreeC~219 DegreeC |
| Viscosity | 200 +- 30 Pa.s (25 +/-1 DegreeC, 10 rpm, Malcom) |
| Weight | 11 g |
- The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others.
- Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow.
- This paste is lead-free and ideal for gap filling and on vertical surfaces application.
Specifications:
| Shenmao / PAI Lead Free Solder Paste Sn-Ag-Cu (SAC) Series | ||||||
| Item/Product | SP606-P | SP607-P | SP608-P | SP609-P | SP610-P | SP614-P |
| Alloy | Sn/Ag3.0Cu0.5 | Sn/Ag3.5/Cu0.7 | Sn/Ag3.9/Cu0.6 | Sn/Ag3.8/Cu0.7 | Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01 | Sn/Ag4.0/Cu0.5 |
| Melting Point (°C) | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 |
| Particle Sixe (um) | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45 , 20-38 |
| Flux Content (%) | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 |
| Flux Type | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 |
| Halide content(%) | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
| Fluoride | None | None | None | None | None | None |
| Viscosity (Pa.s) | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 |
| Spread(%) | 80 | 80 | 80 | 80 | 80 | 80 |
| Tackiness (gf) | 140 | 140 | 140 | 140 | 140 | 140 |
| Corrosion | PASS | PASS | PASS | PASS | PASS | PASS |
| S.I.R | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 |
| Electro Migration | PASS | PASS | PASS | PASS | PASS | PASS |
Note: We also provide lead-free micro solder paste for flip chip process.
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Pai Aims Lead Free Solder Paste
Product Price: Rs 13,104 / KgGet Best Price
Minimum Order Quantity: 1 Kg
Product Brochure
Product Details:
| Packaging Size | 1 Kg |
| Usage/Application | Electronics |
| Brand | Pai Aims |
| Model Name/Number | Pai Aims Lead Free Solder Paste |
- The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others.
- Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow.
- This paste is lead-free and ideal for gap filling and on vertical surfaces application.
Specifications:
| Shenmao / PAI Lead Free Solder Paste Sn-Ag-Cu (SAC) Series | ||||||
| Item/Product | SP606-P | SP607-P | SP608-P | SP609-P | SP610-P | SP614-P |
| Alloy | Sn/Ag3.0Cu0.5 | Sn/Ag3.5/Cu0.7 | Sn/Ag3.9/Cu0.6 | Sn/Ag3.8/Cu0.7 | Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01 | Sn/Ag4.0/Cu0.5 |
| Melting Point (°C) | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 |
| Particle Sixe (um) | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45 , 20-38 |
| Flux Content (%) | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 |
| Flux Type | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 |
| Halide content(%) | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
| Fluoride | None | None | None | None | None | None |
| Viscosity (Pa.s) | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 |
| Spread(%) | 80 | 80 | 80 | 80 | 80 | 80 |
| Tackiness (gf) | 140 | 140 | 140 | 140 | 140 | 140 |
| Corrosion | PASS | PASS | PASS | PASS | PASS | PASS |
| S.I.R | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 |
| Electro Migration | PASS | PASS | PASS | PASS | PASS | PASS |
Note: We also provide lead-free micro solder paste for flip chip process. price validity will 3 days only.
Additional Information:
- Delivery Time: 2/3 weeks
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Solder Sticks
Product Price: Rs 2,500 / KgGet Best Price
Minimum Order Quantity: 20 Kg
Product Details:
| Composition | 60/40 Tin/Lead |
| Usage/Application | For Soldering |
| Melting Point | 140 DegreeC |
| Wire Gauge | 16 SWG |
| Packaging Size | 250 Grams/Reel |
| Packaging Type | Boc |
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Lead Free Solder Paste
Product Price: Rs 6,800 / KgGet Best Price
Product Brochure
Product Details:
| Usage/Application | For Industrial Use |
| Brand | Sharang |
| Physical State | Paste |
| Country of Origin | Made in India |
- The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others.
- Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow.
- This paste is lead-free and ideal for gap filling and on vertical surfaces application.
Specifications:
| Shenmao / PAI Lead Free Solder Paste Sn-Ag-Cu (SAC) Series | ||||||
| Item/Product | SP606-P | SP607-P | SP608-P | SP609-P | SP610-P | SP614-P |
| Alloy | Sn/Ag3.0Cu0.5 | Sn/Ag3.5/Cu0.7 | Sn/Ag3.9/Cu0.6 | Sn/Ag3.8/Cu0.7 | Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01 | Sn/Ag4.0/Cu0.5 |
| Melting Point (°C) | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 |
| Particle Sixe (um) | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45 , 20-38 |
| Flux Content (%) | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 |
| Flux Type | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 |
| Halide content(%) | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
| Fluoride | None | None | None | None | None | None |
| Viscosity (Pa.s) | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 |
| Spread(%) | 80 | 80 | 80 | 80 | 80 | 80 |
| Tackiness (gf) | 140 | 140 | 140 | 140 | 140 | 140 |
| Corrosion | PASS | PASS | PASS | PASS | PASS | PASS |
| S.I.R | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 |
| Electro Migration | PASS | PASS | PASS | PASS | PASS | PASS |
Note: We also provide lead-free micro solder paste for flip chip process.
Yes! I am InterestedRequest A Callback