Sharang Corporation

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Soldering Accessories

Offering you a complete choice of products which include pai solder paste, lead free solder wire, pai aims lead free solder paste and lead free solder paste.

PAI Solder Paste

PAI Solder Paste
  • PAI Solder Paste
  • PAI Solder Paste
  • PAI Solder Paste
  • PAI Solder Paste
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Product Price: Rs 3,860 / KgGet Best Price

Product Brochure

Product Details:
Packaging Size11 g
BrandPAI
Material TypePaste
Material CompositionSN63/PB37
Melting Point217 DegreeC~219 DegreeC
Viscosity200 +- 30 Pa.s (25 +/-1 DegreeC, 10 rpm, Malcom)
Weight11 g
Other Details:
  • The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others.
  • Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow.
  • This paste is lead-free and ideal for gap filling and on vertical surfaces application.

Specifications:
Shenmao / PAI Lead Free Solder Paste Sn-Ag-Cu (SAC) Series
Item/Product SP606-P SP607-P SP608-P SP609-P SP610-P SP614-P
Alloy Sn/Ag3.0Cu0.5 Sn/Ag3.5/Cu0.7 Sn/Ag3.9/Cu0.6 Sn/Ag3.8/Cu0.7 Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01 Sn/Ag4.0/Cu0.5
Melting Point (°C) 217-219 217-219 217-219 217-219 217-219 217-219
Particle Sixe (um) 20-45 ,20-38 20-45,20-38 20-45 ,20-38 20-45,20-38 20-45 ,20-38 20-45 , 20-38
Flux Content (%) 11+/-0.5 11+/-0.5 11+/-0.5 11+/-0.5 11+/-0.5 11+/-0.5
Flux Type R0L1 R0L1 R0L1 R0L1 R0L1 R0L1
Halide content(%) 0.05 0.05 0.05 0.05 0.05 0.05
Fluoride None None None None None None
Viscosity (Pa.s) 200+30 200+30 200+30 200+30 200+30 200+30
Spread(%) 80 80 80 80 80 80
Tackiness (gf) 140 140 140 140 140 140
Corrosion PASS PASS PASS PASS PASS PASS
S.I.R > 1 x 109 > 1 x 109 > 1 x 109 > 1 x 109 > 1 x 109 > 1 x 109
Electro Migration PASS PASS PASS PASS PASS PASS

Note: We also provide lead-free micro solder paste for flip chip process.
Yes! I am InterestedRequest A Callback

Lead Free Solder Wire

Lead Free Solder Wire
  • Lead Free Solder Wire
  • Lead Free Solder Wire
  • Lead Free Solder Wire
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Product Price: Rs 4,165 / KgGet Best Price

Product Brochure

Product Details:
Compositionlead free
Wire Gauge22 SWG
Packaging Size500 Grams/Reel
BrandPAI
Country of OriginMade in India
Diameter0.8 mm
MaterialSn99.3Cu0.7
Flux2%
PAI Sn99.3Cu0.7 RoHS compliance solder wires are being formulated with virgin raw metals processed in state-of-the-art Vaccualloy Technology that brings world class quality along. Here, oxygen interaction with alloy is nil and thus, dross formulation is reduced at PCB assembly process. Also an increased flow rate & reduced impurities found. PAI Sn99.3Cu0.7 alloy is compatible for a typical range of flux application formulas used in Electronics Industry today.
Yes! I am InterestedRequest A Callback

Pai Aims Lead Free Solder Paste

Pai Aims Lead Free Solder Paste
  • Pai Aims Lead Free Solder Paste
  • Pai Aims Lead Free Solder Paste
  • Pai Aims Lead Free Solder Paste
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Product Price: Rs 13,104 / KgGet Best Price

Minimum Order Quantity: 1 Kg

Product Brochure

Product Details:
Packaging Size1 Kg
Usage/ApplicationElectronics
BrandPai Aims
Model Name/NumberPai Aims Lead Free Solder Paste
Other Details:
  • The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others.
  • Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow.
  • This paste is lead-free and ideal for gap filling and on vertical surfaces application.

Specifications:
Shenmao / PAI Lead Free Solder Paste Sn-Ag-Cu (SAC) Series
Item/Product SP606-P SP607-P SP608-P SP609-P SP610-P SP614-P
Alloy Sn/Ag3.0Cu0.5 Sn/Ag3.5/Cu0.7 Sn/Ag3.9/Cu0.6 Sn/Ag3.8/Cu0.7 Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01 Sn/Ag4.0/Cu0.5
Melting Point (°C) 217-219 217-219 217-219 217-219 217-219 217-219
Particle Sixe (um) 20-45 ,20-38 20-45,20-38 20-45 ,20-38 20-45,20-38 20-45 ,20-38 20-45 , 20-38
Flux Content (%) 11+/-0.5 11+/-0.5 11+/-0.5 11+/-0.5 11+/-0.5 11+/-0.5
Flux Type R0L1 R0L1 R0L1 R0L1 R0L1 R0L1
Halide content(%) 0.05 0.05 0.05 0.05 0.05 0.05
Fluoride None None None None None None
Viscosity (Pa.s) 200+30 200+30 200+30 200+30 200+30 200+30
Spread(%) 80 80 80 80 80 80
Tackiness (gf) 140 140 140 140 140 140
Corrosion PASS PASS PASS PASS PASS PASS
S.I.R > 1 x 109 > 1 x 109 > 1 x 109 > 1 x 109 > 1 x 109 > 1 x 109
Electro Migration PASS PASS PASS PASS PASS PASS

Note: We also provide lead-free micro solder paste for flip chip process. price validity will 3 days only.

Additional Information:

  • Delivery Time: 2/3 weeks
Yes! I am InterestedRequest A Callback

Lead Free Solder Wire

Lead Free Solder Wire
  • Lead Free Solder Wire
  • Lead Free Solder Wire
  • Lead Free Solder Wire
Get Best Quote
Product Price: Rs 4,165 / KgGet Best Price

Product Brochure

Product Details:
ApplicationPCB Soldering
PAI Sn99.3Cu0.7 RoHS compliance solder wires are being formulated with virgin raw metals processed in state-of-the-art Vaccualloy Technology that brings world class quality along. Here, oxygen interaction with alloy is nil and thus, dross formulation is reduced at PCB assembly process. Also an increased flow rate & reduced impurities found. PAI Sn99.3Cu0.7 alloy is compatible for a typical range of flux application formulas used in Electronics Industry today. Solder prices are based on LME. please ask for prices every time.Price changes everymonth.
Yes! I am InterestedRequest A Callback

Lead Free Solder Paste

Lead Free Solder Paste
  • Lead Free Solder Paste
  • Lead Free Solder Paste
  • Lead Free Solder Paste
Get Best Quote
Product Price: Rs 6,800 / KgGet Best Price

Product Brochure

Product Details:
Usage/ApplicationFor Industrial Use
BrandSharang
Physical StatePaste
Country of OriginMade in India
Other Details:
  • The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others.
  • Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow.
  • This paste is lead-free and ideal for gap filling and on vertical surfaces application.

Specifications:
Shenmao / PAI Lead Free Solder Paste Sn-Ag-Cu (SAC) Series
Item/Product SP606-P SP607-P SP608-P SP609-P SP610-P SP614-P
Alloy Sn/Ag3.0Cu0.5 Sn/Ag3.5/Cu0.7 Sn/Ag3.9/Cu0.6 Sn/Ag3.8/Cu0.7 Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01 Sn/Ag4.0/Cu0.5
Melting Point (°C) 217-219 217-219 217-219 217-219 217-219 217-219
Particle Sixe (um) 20-45 ,20-38 20-45,20-38 20-45 ,20-38 20-45,20-38 20-45 ,20-38 20-45 , 20-38
Flux Content (%) 11+/-0.5 11+/-0.5 11+/-0.5 11+/-0.5 11+/-0.5 11+/-0.5
Flux Type R0L1 R0L1 R0L1 R0L1 R0L1 R0L1
Halide content(%) 0.05 0.05 0.05 0.05 0.05 0.05
Fluoride None None None None None None
Viscosity (Pa.s) 200+30 200+30 200+30 200+30 200+30 200+30
Spread(%) 80 80 80 80 80 80
Tackiness (gf) 140 140 140 140 140 140
Corrosion PASS PASS PASS PASS PASS PASS
S.I.R > 1 x 109 > 1 x 109 > 1 x 109 > 1 x 109 > 1 x 109 > 1 x 109
Electro Migration PASS PASS PASS PASS PASS PASS

Note: We also provide lead-free micro solder paste for flip chip process.
Yes! I am InterestedRequest A Callback

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