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Solders/Fluxes/Solder Paste

We are engaged in supplying qualitative solders, fluxes and solder pastes to our esteemed clients. Known for their high performance, these find application in electronics & electrical and automobile industries. Manufactured using premium grade material at our vendors end, these can be availed in varied grades and specifications to suit the diverse choices of the clients.

Soldering Fluxes

We provide our clients a range of soldering fluxes that are in compliance with the proprietary ISO standards and available in a wide range of alloys. Our range includes rosin/no clean/urea wires (upto 0.71 mm), rosin cored solder wires, no clean solder wires, urea cored solder wires and solid solder wires. These are known for their better spreading characteristics and less residue while soldering.

ROSIN / NO-CLEAN / UREA WIRES

Proprietary ISO standards Flux Types. Wide Range of Alloys available. Rosin/No Clean/Urea Wires (upto 0.71 mm), Rosin Cored Solder Wires, No clean Solder Wires, Urea Cored Solder Wires, Solid solder Wires.

Fluxes For Electronic/Electrical/Automobile Industries:

• PAI 316P2 - Rosin Based Flux
• PAI 8239 - Transparent halide free No clean flux
• PAI 2332 - Hot air leveling flux
• PAI 961 CU 078 - Copper Cleaner
• PAI AO-L369 - Liquid Antioxidant
• PAI AO-P369 - Powder Antioxidant
• PAI 3001 - VOC Free NOclean Flux
• PAI 918 - GLS Lamp Flux
• PAI RF 1881 - Non Corrosive Radiator Flux
• PAI RF - 27 - Neutral Non Corrosive

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Solder Paste

The solder paste offered by us is used in soldering applications in various industries such as electrical, electronics and others. Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature re flow. This paste is lead-free and ideal for gap filling and on vertical surfaces application.

The solder paste we offer has following specifications:

SHENMAO / PAI LEAD FREE SOLDER PASTE Sn-Ag-Cu (SAC) Series
Item/Product	SP606-P	SP607-P	SP608-P	SP609-P	SP610-P	SP614-P
Alloy	Sn/Ag3.0Cu0.5	Sn/Ag3.5/Cu0.7	Sn/Ag3.9/Cu0.6	Sn/Ag3.8/Cu0.7	Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01	Sn/Ag4.0/Cu0.5
Melting Point (°C)	217-219	217-219	217-219	217-219	217-219	217-219
Particle Sixe (um)	20-45 ,20-38	20-45,20-38	20-45 ,20-38	20-45,20-38	20-45 ,20-38	20-45 , 20-38
Flux Content (%)	11+/-0.5	11+/-0.5	11+/-0.5	11+/-0.5	11+/-0.5	11+/-0.5
Flux Type	R0L1	R0L1	R0L1	R0L1	R0L1	R0L1
Halide content(%)	0.05	0.05	0.05	0.05	0.05	0.05
Fluoride	None	None	None	None	None	None
Viscosity (Pa.s)	200+30	200+30	200+30	200+30	200+30	200+30
Spread(%)	80	80	80	80	80	80
Tackiness (gf)	140	140	140	140	140	140
Corrosion	PASS	PASS	PASS	PASS	PASS	PASS
S.I.R	> 1 x 109	> 1 x 109	> 1 x 109	> 1 x 109	> 1 x 109	> 1 x 109
Electro Migration	PASS	PASS	PASS	PASS	PASS	PASS

We also provide lead free micro solder paste for flip chip process.

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Lead Free Solders

We offer lead free solders that are widely recognized due to high quality and less residue while soldering. Procured from our trustworthy manufacturers, these solders are available in various sizes and diameters to suit diverse application requirements. Further, we also procure and supply these in specifications as per the requirements of the clients.

We offer Lead Free Solders recognized due to high quality & following specifications:

SHENMAO / PAI Lead Free Solder

Alloy No.	Alloy Composition	Melting point (°C)	Product				Gravity	Strength (Kgf/mm)	Elongation (%)	Remark
			Bar	Sphere	Wire	Paste
SP601	Sn-Ag2.5-Cu0.5	220°C	O	O	O		7.40	5.3	57	Medium temperature alloy
SP602	Sn-Bi58	13tfC	O	O	O	O	8.56	7.8	27	Low temperature alloy
SP603 +	Sn-Ag3.5	221°C	0	o	O	O	7.36	4.18	58	Soldering rework use
SP604 *	Sn-Cu0.7	227"C	o	O	O		7.32	3.80	50	Wave soldering & rework
SP6O5	Sn99.95	232°C	o	O	O		7.28	2.20	55	Medium temperature alloy
*SP6O6 +	Sn-Ag3.0-Cu0.5	219t;	o	o	O	o	7.40	5.30	47	Medium temperature alloy
*SP607	Sn-Ag3.5-Cu0.7	217t;	o	o	O	o	7.42	5.34	48	Medium temperature alloy
SP608	Sn-Ag3.9-Cu0.6	217t	o	o	O	o	7.42	5.34	48	Medium temperature alloy
SP6O9	Sn-Ag3.8-CuO.7	217t	0	0	O	o	7.42	5.34	48	Medium temperature alloy
**SP610+	Sn-Ag3.O-CuO.5-NiO.O6- GeO.Ol	219t	o	o	O	o	7.40	5.40	48	Medium temperature alloy
SP614	Sn-Ag4.0-Cu0.5	217°C	o	o	O	o	7.42	5.34	48	Medium temperature alloy

*U.S. Patent No. 5.527.628
**PF610 A This is our alloy composition to recommend "Sn-Ag-Cu" system1 C

Japanese Patent No. 3296289 C U.S Patent No. 6179935B1
We also manufacture Solder with Alloy Composition Sn97-CuO3
Alloy No. SP604 can be supplied with addition of Ag, Ni, Ge

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Solders/ Fluxes/ Solder Paste

We supply wide array of solders, fluxes and solder paste. Our wide array of products comprises of flux cored solder wires, solid solder wires/ sticks/ anodes, fluxes, lead pipes & tubes, foils and spheres.

Flux cored solder wires, supplied by us are appreciated in the market for their better spreading characteristics and less residue while soldering.

Our qualitative lead tubes adhere to IS 404 Part II standard and are known for their strength and durability. Available in various sizes ranging from 3 mm to 30 mm diameter, these tubes are used in chemical heat exchangers and condensers.

We supply wide spectrum of solid solder wires/ sticks/ anodes that are manufactured by OEMs by using premium grade of tin/ lead, tin/ cadmium, tin/ zinc, tin/ lead/ antimony, tin/ silver and tin/ lead/ silver.

Foils trade by us are manufactured from premium grade of tin/lead, tin/cadmium, tin/zinc, tin/lead/antimony, silver, tin/lead/silver and are available in different thickness of 0.03 mm thick up to 50 mm.

As per the requirements of clients, we procure and supply spheres of different sizes ranging from 10 mm to 25 mm.

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Mr. Ramesh Borekar
Off. No. 106, Laxmi Plaza, 1st Floor, Opposite Alfa Laval, Pune Bombay Road, Kasarwadi
Pune, Maharashtra - 411 012, India
Telephone: +(91)-(20)-32417448

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